Microchip Technology recently introduced new MPFS025T/095T/160T/250T PolarFire SoC devices with Tgrade2 operating conditions in standard and -1 speed grades and MPFS095TS/250TS/460TS devices with MIL operating conditions in 1,0 V and 1,5 V standard speed grades with Libero SoC v2021.3 Design Suite.
With the version 2021.3 release, Microchip enhanced place-and-route minimum delay repair for external timing closure of IOD interfaces and enhanced XCVR ERM to improve transceiver robustness for PolarFire, RT PolarFire and PolarFire SoC FPGA families of FPGAs. It also introduced export BSDL file support, enabled programming for MPFS250T/TS/TL/TLS and MPFS025T/TS/TL/TLS devices, introduced an option to configure I/O states during JTAG programming, introduced an option to invoke MSS configurator from Libero SoC Design Suite as read-only mode and introduced a device check option when importing MSS components (CXZ) to Libero SoC Design Suite for PolarFire SoC FPGA devices.
With the release of version 2021.3 of SmartHLS, which is embedded in Libero SoC Design Suite v2021.3, IGLOO 2 FPGA family support was added. A new branchless flatten function feature was added to improve parallelism and replicate ROM pragma was introduced to enable and control ROM (array) replication for higher memory bandwidth and improved expression balancing optimisation to reduce cycle latency of generated hardware with the SmartHLS v2021.3 release.
More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
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Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
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Telecoms, Datacoms, Wireless, IoT
Vishay Intertechnology has introduced a new series of infrared (IR) receiver modules for IR remote control applications, which feature a wide modulation frequency acceptance from 30 kHz to 68 kHz.
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Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
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DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
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