Fuji’s NXTR smart factory platform offers a truly modular design for the optimal line configuration that caters to your production needs. Real-time sensing placement, optimised placement actions and part handling checks after placement are just a few examples.
Placements can be performed with a high accuracy of ±25 µm at all times and there are no constraints on the head type or the part to be placed. Additionally, controlling the push-in amount during placement allows for placement with the appropriate pressure.
The installed IPS system can cater to a wide range of checks, from part pickup stance to parts remaining on nozzles, as well as upside-down checks for mini-mould parts. It prevents placement defects attributed to packaging, nozzles and parts.
As an optional extra, placement defects caused by operation errors and defective parts are prevented by checking the electrical properties of chip parts with LCR checks and by checking the leads and bumps on IC parts with coplanarity checks.
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