Reflow ovens with waterless/filterless flux separation
EMP 2022 Electronics Manufacturing & Production Handbook
Manufacturing / Production Technology, Hardware & Services
The 1936 and 2043 Mark5 (MK5) systems from Heller deliver high levels of repeatability with very low delta-Ts. The latest breakthroughs associated with the MK5 reflow system now provide you with an even lower cost of ownership. Heller’s new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption.
Advancements like the invention of the first waterless/filterless flux separation system earned Heller the prestigious Frost & Sullivan award for innovation in reflow soldering. More importantly, this development extended preventive maintenance intervals from weeks to months for Heller’s systems. Additional breakthroughs in energy management have helped Heller’s customers remain environmentally responsible while still maintaining their sustainability guidelines.
Further reading:
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MTN SA Foundation drives youth pathways into the digital economy
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The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
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[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
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The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
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Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
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The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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Understanding solder dross: causes and control strategies
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Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
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Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
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This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
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Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
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With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
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The causes of solder balls in robotic soldering
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Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
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Material challenges for superconducting quantum chips
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To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
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