News


$1 billion Intel fund for disruptive technologies

24 November 2021 News

Intel announced a new $1 billion fund to support early-stage startups and established companies building disruptive technologies for the foundry ecosystem. A collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritise investments in capabilities that accelerate foundry customers’ time to market – spanning intellectual property (IP), software tools, innovative chip architectures and advanced packaging technologies.


Intel also announced partnerships with several companies aligned with this fund and focused on key strategic industry inflections: enabling modular products with an open chiplet platform and supporting design approaches that leverage multiple instruction set architectures (ISAs) spanning x86, Arm and RISC-V.

“Foundry customers are rapidly embracing a modular design approach to differentiate their products and accelerate time to market. Intel Foundry Services is well-positioned to lead this major industry inflection. With our new investment fund and open chiplet platform, we can help drive the ecosystem to develop disruptive technologies across the full spectrum of chip architectures.”

As a key part of its integrated device manufacturer (IDM) 2.0 strategy, Intel recently established IFS to help meet the growing global demand for advanced semiconductor manufacturing. In addition to providing leading-edge packaging and process technology and committed capacity in the US and Europe, IFS is positioned to offer the foundry industry’s broadest portfolio of differentiated IP, including all of the leading ISAs.

A robust ecosystem is critical to helping foundry customers bring their designs to life using IFS technologies. The new innovation fund was created to strengthen the ecosystem in three ways:

“Intel is an innovation powerhouse, but we know that not all good ideas originate from within our four walls,” said Randhir Thakur, president of Intel Foundry Services. “Innovation thrives in open and collaborative environments. This $1 billion fund in partnership with Intel Capital – a recognised leader in venture capital investing – will marshal the full resources of Intel to drive innovation in the foundry ecosystem.”

Truly tapping the power of modular architectures requires an open ecosystem since the approach brings together design IP and process technologies from multiple vendors. IFS is enabling this ecosystem with its open chiplet platform, co-developed with CSPs (cloud service providers) to accelerate the platform and package integration of customers’ accelerator IP. The platform will leverage Intel’s leadership packaging capabilities with IP optimised for IFS’ advanced process technologies, combined with services to accelerate customer time to market with integration and validation.

Additionally, Intel is committed to partnering with other industry leaders to develop an open standard for a die-to-die interconnect that allows chiplets to communicate with each other at high speeds. Leveraging a strong track record of widely deployed standards – such as USB, PCI Express and CXL – Intel says the industry can drive a new, open ecosystem that will enable interoperable chiplets from different foundries and process nodes to be packaged using a wide variety of technologies.




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Vicor Powering Innovation podcast
News
The episode explores electrification with Lightning Motorcycles, a company that produces the fastest electric motorcycle on the planet.

Read more...
ModusToolbox Workshop 3
News
This workshop will focus on enabling a PSoC development kit, connected over Wi-Fi and leveraging MQTT, to create the framework of an IoT application.

Read more...
Indium celebrates 90 years of innovation
Techmet News
The company’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies.

Read more...
Revamped technical training centre in Welkom
News
Resolution Circle has announced the launch of its newly revamped training centre in Welkom, which will enhance technical education and foster industry partnerships.

Read more...
From the editor's desk: Funga: The unseen rulers of a new kingdom
Technews Publishing News
Up until a few weeks ago, our classification kingdoms were split into two parts; fauna and flora. I was amazed when I recently read that National Geographic has now changed this and has split the classification ...

Read more...
Hiconnex announces new partnership
Hiconnex News
With over 60 years of experience in the civil, military aeronautics, and space industries, Petercem offers robust solutions for position detection and human machine interfaces.

Read more...
Global semiconductor sales increase YoY
News
The Semiconductor Industry Alliance (SIA) has announced global semiconductor sales totalled $47,6 billion during the month of January, an increase of 15,2% compared to January 2023.

Read more...
Utility-scale solar development for local company
News
Teraco has announced that it has secured its first grid capacity allocation from Eskom, and will commence construction of a 120 MW utility-scale solar PV energy facility in the Free State province.

Read more...
Collab between Arrow and Infineon
Altron Arrow News
Arrow Electronics, represented by Altron Arrow in South Africa, and its engineering services company, eInfochips, are working with Infineon Technologies to help eInfochip’s customers accelerate the development of EV chargers.

Read more...
Printing as a subscription
News
HP has done the unthinkable and released its All-In Plan, a subscription-based printing solution that has many IT professionals and business users shaking their heads.

Read more...