DSP, Micros & Memory


ST integrates brains into sensors to launch ‘Onlife Era’

28 February 2022 DSP, Micros & Memory Analogue, Mixed Signal, LSI

STMicroelectronics announced the launch of the seminal Intelligent Sensor Processing Unit (ISPU) that combines a digital signal processor (DSP) suited to run artificial intelligence (AI) algorithms and a micro electro-mechanical system (MEMS) sensor on the same silicon.

In addition to reducing size over system-in-package devices and cutting power by up to 80%, merging sensor and AI brings electronic decision-making in the application edge. Here, it facilitates what ST calls the ‘Onlife Era’ where innovative products enabled by smart sensors are able to sense, process and take actions, creating a fusion of technology and the physical world.

The Onlife Era acknowledges living with continuous assistance from connected technologies, enjoying natural, transparent interactions and seamless transitions with no discernible distinction between online and offline. With the ISPU, ST is looking to enable this by helping to migrate intelligent processing into sensors that support the fabric of life: no longer ‘at’ the edge but ‘in’ the edge.

The company says its ISPU provides substantial benefits in the four Ps: power consumption, packaging, performance and price. The proprietary ultra-low-power DSP can be programmed in C, familiar to many engineers and also allows quantised AI sensors to support full- to single-bit-precision neural networks. This ensures cutting-edge accuracy and efficiency in tasks such as activity recognition and anomaly detection by analysing inertial data.

“While technically challenging, integrating ST’s sensors on the same piece of silicon with our ISPU does improve sensor-based systems from an online experience to an Onlife one. It advances the sensor’s features to speed decision-making by reducing data transfers, enhancing privacy by keeping data local, while reducing size and power consumption, which cuts costs,” said Andrea Onetti, executive vice president, MEMS sub-group, STMicroelectronics. “Moreover, the ISPU is easily programmable with commercial AI models and can ultimately operate with all of the leading AI tools.”

ST’s proprietary, C-programmable DSP is an enhanced 32-bit RISC machine. It is extensible (in the chip-design phase) for dedicated instructions and hardware components. The processor offers a full-precision floating-point unit, uses a fast four-stage pipeline, operates from 16-bit variable-length instructions and includes a single-cycle 16-bit multiplier. Interrupt response is a spritely four cycles. ST’s sensors with ISPUs will be packaged in standard 3 x 2,5 x 0,83 mm packages and will be pin-compatible with its predecessors, allowing quick upgrades.

By combining the sensor and ISPU, ST’s calculations show a 5-6 times power saving over system-in-package approaches in sensor fusion applications. They also show a 2-3 times power saving in run mode.




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved