The SP701 Evaluation Kit, equipped with the Spartan-7 FPGA, is built for designs requiring sensor fusion, such as industrial networking, embedded vision and automotive applications. The SP701 features high I/O availability and I/O expansion capability via Pmods and FMC connectors, making it the largest IP development canvas for Spartan-7 FPGA users.
The included XC7S100 FPGA is the highest-density device of the Spartan-7 family. With 102K logic cells and 400 I/O pins, the XC7S100 pairs expandable connectivity with high processing capability, all in a form factor ideal for edge applications.
Xilinx has also produced an on-demand webinar showing how the Spartan-7 family delivers processor scalability, any-to-any connectivity, sensor fusion and custom hardware acceleration, all at a low-cost entry point. Using a push-button and plug-and-play flow, it demonstrates how rapidly one can prototype an embedded system such as a microcontroller, real-time processor or application processor on the SP701 evaluation kit.
The webinar will specifically cover the following:
• How a Spartan-7 FPGA can replace a multi-chip ASSP-based solution – A technical overview of Spartan-7 capabilities and its fundamental building blocks.
• How to rapidly prototype with the SP701 evaluation kit – Two demonstrations of how to build a system from scratch.
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