DSP, Micros & Memory


Quectel releases a 5G SG560D smart module series

31 August 2022 DSP, Micros & Memory

The SG560D is a series of Quectel’s new generation multi-mode 5G smart modules with built-in Android 12 OS. Based on QCM6490 high-performance 64-bit octa-core processors with a built-in Adreno 643 GPU, it is ideal for both industrial and consumer applications requiring high data rates and multimedia functions.

“In the era of Artificial Intelligence of Things (AIoT), computing capability becomes more critical to make devices smarter and more responsive. Our 5G SG560D module combines 5G and AI technologies to deliver state-of-the-art performance in communication and data processing,” said Patrick Qian, CEO of Quectel. “I believe the SG560D will offer an excellent option for edge computing requirements and will accelerate the digital transformation of devices.”

The module supports 3GPP Rel-15 technology and supports both 5G NSA and SA modes with 4G/3G fallback. In addition, the module supports Wi-Fi 6E & DBS, IEEE 802.11a/b/g/n/ac/ax, Wi-Fi 2 × 2 MU-MIMO and Bluetooth 5.2.

The SG560D series supports 5G and LTE multi-user multiple-input multiple-output (MU-MIMO) technology. The use of multiple antennas at the receiver end at the same time and on the same frequency band greatly minimises errors and optimises the data speed. This module also combines high-speed wireless connectivity with an embedded multi-constellation and high-sensitivity GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) receiver for positioning.

A rich set of interfaces (such as LCM, camera, touch panel, PCIe, UART, USB, I2C, and I2S) allow the module to serve a wide range of M2M applications including as a smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, digital signage and industrial PDAs.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Module for smart city and smart utility devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.

Read more...
Microchip enhances digital signal controller lineup
Future Electronics DSP, Micros & Memory
Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller families to its dsPIC33A DSC product line.

Read more...
MCX C Series development board
Avnet Silica DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.

Read more...
Redefining entry-level MCUs
NuVision Electronics DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.

Read more...
What is Wi-Fi HaLow and why choose it for IoT?
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.

Read more...
Microchip enhances TrustMANAGER platform
Altron Arrow DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.

Read more...
MCU for low-power, IoT applications
NuVision Electronics DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.

Read more...
EEPROMs for industrial and military markets
Vepac Electronics DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.

Read more...
PLCnext – Open, IIoT-ready industrial platform
IOT Electronics DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.

Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved