Building insulation is becoming increasingly efficient in combatting the effects of climate change and in reducing the overall energy consumption. However, heavily insulated buildings are not always good news for human health.
Poor ventilation can result in lower oxygen levels and a build-up of carbon dioxide (CO2). Even moderate levels of CO2 can have a negative impact on health and productivity - at 1000 ppm, people begin to experience drowsiness and have difficulty concentrating.
Consequently, CO2 sensor module manufacturers are facing a growing demand for smart indoor air quality sensors that can sense rising levels of CO2, and either alert the user or trigger a system response. Smart home CO2 sensors enable real-time CO2 monitoring for demand-controlled ventilation systems, air purifiers, and thermostats while allowing users to accurately measure and adjust indoor air quality.
Infineon has developed a CO2 sensor chip that provides accurate, real-time CO2 measurement, thanks to superior MEMS technology. The MEMS-based CO2 sensor uses Infineon's MEMS microphone, which acts as a pressure sensor and is optimised for low-frequency operation. The XENSIV PAS CO2 sensor module integrates a PAS transducer, a microcontroller, and a MOSFET on the PCB.
There are three CO2 sensor types that are mainly used in the industry. These include PAS (photoacoustic spectroscopy) sensors, NDIR (non-dispersive infrared) sensors, and EC (electrochemical) sensors. Infineon's XENSIV PAS CO2 sensor matches the performance of NDIR and EC sensors, while being more affordable and compact, making it the ideal solution for smart home and building automation applications.
Along with size and cost advantages, the sensor delivers superior accuracy, providing a direct readout of the real CO2 level, not simply a correlation. Reliable CO2 sensor measurement enables smart monitoring of indoor air quality, allowing users to take control of their environmental conditions and experience improvements in health, productivity, and overall wellbeing.
Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version