DSP, Micros & Memory


New hybrid sensor for in-car safety and comfort monitoring

26 October 2022 DSP, Micros & Memory

As leading automotive markets start to mandate driver-monitoring systems (DMS), STMicroelectronics is already equipping carmakers with the required technologies. While DMS promises greater road safety by assessing driver alertness, the next-generation dual image sensor from ST monitors the full vehicle interior, covering both the driver and all passengers. New applications enabled by ST’s new image sensor include passenger safety-belt checks, vital-sign monitoring, child-left detection, gesture recognition, and high-quality video/picture recording.

“The DMS market is growing at a double-digit pace and ST’s new image sensor is set to push that forward by enabling brands to create new services and deliver even greater value for vehicle users, leveraging complete in-cabin monitoring that covers multiple occupants,” said Eric Aussedat, executive vice president, imaging sub-group general manager, STMicroelectronics. “Our market-leading DMS sensor provided the perfect launchpad to take the technology further and empower new innovations.”

The new sensor, the VD/VB1940, delivers a cost-effective solution that combines the sensitivity and high resolution of infrared sensing with high dynamic range (HDR) colour imaging in a single component. It can capture frames in rolling-shutter or global-shutter modes. With 5,1-megapixels, it captures the high-dynamic-range (HDR) colour images needed for an occupant monitoring system (OMS) in addition to the high-quality near-infrared (NIR) images typically captured by standard DMS sensors. DMS uses NIR imaging to analyse driver head and eye movements in all lighting conditions.

The new automotive image sensor uses ST’s second-generation 3D-stacked back-side illuminated (BSI) wafer technology, which maximises the optical area and on-chip processing in relation to die size. This lets the sensor perform sophisticated algorithms locally for optimal performance in both colour and NIR imaging, saving power and relieving demand for an external co-processor.

Algorithms performed on-chip include Bayer conversion and HDR merging for optimal image-quality and frame rate. On-chip Bayerisation processing enables the user to reshuffle the colour pixels of the RGB NIR 4X4 pattern into the RGGB format compatible with a wide range of SoCs. In addition, local processing also handles independent colour and NIR pixel-exposure optimisation for optimum image quality in both modes, as well as smart upscaling to maximise NIR image resolution by capturing extra NIR information from RGB pixels.

ST has planned to meet demand for 2024 model vehicles that are currently in design.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

1 GHz crossover MCU with Arm Cortex Cores
Future Electronics DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.

Read more...
NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.

Read more...
High-performance module for physical AI applications
Avnet Silica AI & ML
congatec has introduced its new COM-HPC Client Size C module with AMD Ryzen AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications.

Read more...
UFS 5.0 flash for on-device AI
EBV Electrolink DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

Read more...
Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved