Micron has released its HBM3 Gen2 high bandwidth memory to advance generative AI innovation. Generative AI opens a world for new forms of creativity and expression, and unlocks new possibilities for businesses, IT, engineering, science and medicine.
HBM3 Gen2 delivers faster data rates and improved thermal response. The memory has a 50% higher monolithic die density within the same package footprint as the previous generation. With advanced CMOS technology and 1β process technology, Micron’s HBM3 Gen2 provides bandwidth that exceeds 1,2 TB/s. This increase in memory bandwidth improves system-level performance, which reduces training time by more than 30% and allows up to 50% more queries per day.
Micron’s HBM3 Gen2 8-high cube delivers 24 GB of memory with excellent power efficiency for all AI applications.
High reliability memories Altron Arrow
DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...SoC for real-time AI at the edge Future Electronics
DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
Read more...Evaluation kit for ML applications Future Electronics
DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.
printer friendly version