Webinar: Latest developments in IoT device security
27 September 2023
DSP, Micros & Memory
IoT device security is changing rapidly. Organisations that build and deploy connected devices have heightened threat awareness, and government entities worldwide are developing legislation that require embedded devices to be secure.
NXP, in partnership with Digi and Timesys, is offering a live one-hour webinar, where they will introduce Edgelock Secure Enclave. This system is a new built-in security subsystem included in the latest i.MX processors, including the i.MX 93 in the Digi ConnectCore 93.
Digi will introduce the Digi ConnectCore Security Services, an award-winning solution that enables developers to keep products secure through their full lifecycle.
Timesys will then highlight the important of Software Bill of Material (SBoM) management, provided in its innovative Vigiles services.
Date: 14 November 2023
Time: 17:00 SAST
To register, visit https://bitly.ws/XBo7
Further reading:
PolarFire SoC FPGAs achieve AEC-Q100 qualification
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Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.
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Integrated STM32WBA6 wireless microcontrollers
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Ultra-low-power MCU with FPU Arm Cortex-M33
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STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.
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Low-jitter oscillators
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The JOH21, JOE21 and JOD21 low-jitter oscillators with differential output are designed for applications that require accurate timing and precise synchronisation.
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Raspberry Pi 5 SBC
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The Raspberry Pi 5 single board computer builds on the phenomenal success of its predecessor, the Raspberry Pi 4, delivering a 2-3x increase in CPU performance.
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The world’s first RISC-V MCU to achieve PSA-L2
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Espressif’s ESP32-C6 is the world’s first RISC-V MCU to achieve PSA-L2 security certification, security certification, underscoring the company’s commitment to delivering robust, secure, and reliable IoT solutions.
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32 Mbit SRAM chip
Brabek
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To meet the demand for high-density fast CMOS SRAM, Alliance Memory has introduced a new 32 Mbit device in the 6 x 8 mm 48-ball FBGA package, which offers a wide power supply range from 1,65 to 3,6 V.
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Connectivity for industrial applications
iCorp Technologies
DSP, Micros & Memory
Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.
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Eval board for MEMS sensors
Altron Arrow
DSP, Micros & Memory
ST’s STEVAL-MKI109D is an evaluation platform that allows engineers to monitor the behaviour of ST MEMS sensors and maximise the performance of new product designs, accelerating time to market.
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High reliability memories
Altron Arrow
DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.
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