Telecoms, Datacoms, Wireless, IoT

Sakura debuts for edge AI

22 November 2023 Telecoms, Datacoms, Wireless, IoT

EdgeCortix has made a strategic shift from selling AI intellectual property (IP) to selling its own edge-AI inference chips for line-powered systems. The new die, dubbed Sakura, started as a test chip, but the company says customer interest convinced it to offer the chip as a product. The chips come mounted on one of two cards: a dual-M.2 (M-key) card and a low-profile PCIe card. Based in Japan, EdgeCortix has supplemented its $13,5 million in total funding with revenue from FPGAs and ASICs that employ its soft IP. It targets perception – vision, lidar, and related technologies – are aimed at transportation, augmented/virtual reality, industry, smart cities, and drones.

Sakura, revealed first at the recent Linley Spring Processor Conference, implements the company’s dynamic neural accelerator (DNA) engine, adding on-chip SRAM, two LPDDR4X ports, and I/O. The chip has no host CPU, so it operates under the control of an external host. Sakura has a maximum performance of 40 TOPS; on ResNet-50, it achieves 0,4 ms latency at 4,7 W, yielding 533 inferences per second per watt (IPS/W).

Sakura combines six engines for standard 3D convolutions, six engines for 2D depth-wise convolutions, and three vector engines for activations and other miscellaneous operations. Standard convolutions combine all three colour channels, whereas depth-wise convolutions separate the channels, combining results later to reduce computing operations. To boost utilisation, the Mera tools can convert between standard and depth-wise convolutions to keep all engines occupied. Together, the engines are capable of 25 000 MACs per clock cycle.

Within a vector engine, dedicated blocks implement activation functions. Each block is configurable for a range of variants in a family of activation functions. Although this approach yields better performance, it’s less flexible than a fully programmable engine. A 20 MB on-chip SRAM can hold weights and activations or act as a scratchpad. The runtime software reconfigures the network-on-a-chip (NoC) on the fly, reassigning engines as part of EdgeCortix’s focus on achieving high hardware utilisation.

RFiber Solutions has added this group to its line card.


Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Antennas to meet all connectivity requirements
Electrocomp Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.

Introducing SIMCom’s new A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

18 W monolithic microwave amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.

LoRaWAN-certified sub-GHz module
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module which incorporates two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications.

3D depth sensing sensor
Avnet Silica Telecoms, Datacoms, Wireless, IoT
A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.

Quectel announces module for RedCap comms
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The Quectel RG255G offers downlink performance of 220 Mbps, and uplink performance of 121 Mbps on 256QAM or 91 Mbps on 64QAM.

Wide-Bandgap Developer Forum
Infineon Technologies Telecoms, Datacoms, Wireless, IoT
This year marks a new chapter for this exclusive event series – all specialist presentations will be broadcasting live from a studio in Munich.

Multimode smart LTE module with GNSS
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The AW200Z LTE module is equipped with Bluetooth and Wi-Fi functionalities, and is powered by Qualcomm's advanced 64-bit quad-core Cortex-A53 processors, coupled with an integrated Adreno 702 GPU.

LEXI-R10 series cellular module
RF Design Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.

Quectel modules above average in security
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that nearly 95% of all its modules shipped to the United States since the beginning of 2022 have industry-leading security scores based on penetration testing and binary analysis by Finite State.