MediaTek releases its new flagship SoC
29 February 2024
DSP, Micros & Memory
Taiwanese semiconductor manufacturer MediaTek has released its new flagship SoC for mobile devices. The announcement of the Dimensity 9300 comes just weeks after Qualcomm announced its new SoC, the Snapdragon 8 Gen 3, with the hope that it will rival both Apple’s and Qualcomm’s latest offerings.
Unlike previous iterations of processors that use eight cores in a 1 + 4 + 3 design, the Dimensity 9300 foregoes this to include eight performance cores in a 4 + 4 design: four Cortex-X4 processors running at up to 3,25 GHz are combined with four Cortex-A720 processors that can run up to 2 GHz for less taxing tasks. Level 3 cache has also been expanded to 18 MB, 29% larger than the previous generation.
This provides a 15% single-core performance increase, and a larger 40% increase in multi-core performance. However, even with the increase in processing performance, the SoC produces a 33% power saving during multi-core usage.
The Dimensity 9300 is built on TSMC’s third generation 4 nm process, and is housed in a thermally-optimised package designed by MediaTek. The SoC is also the first to use LPDDR5T 9600 Mbps memory.
As with most newly released processors, the 9300 has also been given the generative AI treatment with 8x faster transformer-based generative AI performance and 2x faster integer and floating-point computing. This translates to executing AI models with up to 33 billion parameters, while being 45% more efficient.
The processor includes Arm’s latest flagship GPU architecture, the Immortalis-G720 GPU, which provides raytracing and 46% extra peak performance over the previous generation. This 12-core GPU can provide a raytracing experience at a smooth 60 fps.
Seamless 5G connectivity is provided with the R16 modem supporting Sub-6 GHz and mmWave transmissions. The first devices using this new chipset should be on the market by the end of 2023.
Further reading:
ESP32-C6 achieves PSA-L2
iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...
Microprocessor with integrated NPU
Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...
Nordic Semiconductor launches nRF Connect SDK Bare Metal option for nRF54L series
Avnet Silica
DSP, Micros & Memory
This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.
Read more...
Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...
Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...
MultiVolt series of oscillators
Future Electronics
DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.
Read more...
MCU platform for battery-powered devices
Altron Arrow
DSP, Micros & Memory
The MCX W23 is a new dedicated wireless MCU platform from NXP for battery-powered sensing devices.
Read more...
Drive innovation with AURIX TriCore MCUs
Future Electronics
DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.
Read more...
Elevate your motor control designs
EBV Electrolink
DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.
Read more...
Embedded platform for compute-intensive applications
iCorp Technologies
DSP, Micros & Memory
The Quectel QSM368ZP-WF is a fully featured embedded ARM platform optimised for compute-intensive industrial and IoT applications.
Read more...
printer friendly version