The latest Banana Pi single board computer, the BPI-M7, is powered by Rockchip’s latest flagship RK3588 octa-core 64-bit processor, with a maximum frequency of 2,4 GHz. The SBC features a Mali G610MC4 GPU, a neural processing unit capable of 6 TOPS, and up to 32 GB of RAM.
The board has triple display support and can encode/decode 8K video. Communications is provided onboard via two 2.5G Ethernet interfaces, and also includes Wi-Fi 6 and Bluetooth 5.2 support. A 40-pin header to GPIO and I2C is included on the board.
With support for various operating systems, the SBC is suitable for a wide array of applications including ARM PCs, edge computing, cloud servers and computing, AI, and virtual/augmented reality.
Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...Wall-mount cooling for Edge IT
AI & ML
Designed to run 24/7 in critical compute environments, Vertiv CoolPhase Wall delivers up to 60% greater airflow than comfort cooling.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Edge AI improves condition monitoring EBV Electrolink
AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.
Read more...Powering smart sensor networks CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec’s NeoMesh wireless mesh networking protocol and software stack is ideally suited for powering smart sensor networks where each device is required to send and receive small packets of data infrequently, but with high reliability.
Read more...Tiny SoM integrates NXP i.MX 91
AI & ML
The QS91 module from Direct Insight utilises the low-cost single core i.MX 91 to deliver secure, energy-efficient Linux capabilities for edge applications.
Read more...Robotics platform powers intelligent systems Vepac Electronics
AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
Read more...SensorGPT speeds intelligent IoT deployment
AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
Read more...Ideal entry point into edge AI Avnet Silica
AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
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