The nRF9151 from Nordic Semiconductor is an integrated System-in-Package (SiP) supporting LTE-M/NB-IoT, DECT NR+ and GNSS services. It supports the 700 to 2200 MHz LTE band and 1,9 GHz NR+ band.
This SiP has an integrated LTE-M/NB-IoT and DECT NR+ modem that enables global connectivity without regional limitations. It also supports 3GPP Rel-14 LTE-M/NB-IoT and DECT NR+ stack that enables massive mesh applications that prioritise reliability, secure connections, long range, and scalability.
The SiP delivers a Tx output power of 20dBm (power class 5) or 23 dBm (power class 3). The integrated 64 MHz ARM Cortex-M33 processor has 1 MB of Flash memory and 256 kB RAM. It is ideal for use in wearable devices, smart sensors, and other space-constrained IoT applications.
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With Avocado OS now available on the HummingBoard RZ-V2N-
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The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
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Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
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Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
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Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
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Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
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Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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