27 November 2025Manufacturing / Production Technology, Hardware & Services
Mycronic’s PCB Assembly Solution division has announced the launch of GenI, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection programming. GenI empowers users to introduce new products in just 10 minutes compared to several hours with conventional AOI systems, without requiring any AOI programming skills.
The system solves the core challenge of time-consuming AOI programming, offering true 3D metrology inspection and full measurement traceability. Mycronic is the only AOI supplier with direct access to pick-and-place programs, enabling full metrology inspection. With this new software solution, inspection reliability is no longer dependent on programmer skill or experience.
“GenI is more than a technical breakthrough – it is a strategic leap for manufacturers and stakeholders alike. By removing the barriers of AOI programming and enabling rapid, reliable inspection, we are empowering our customers to accelerate innovation and maximise operational efficiency,” said Alexia Vey, product manager inspection, PCB Assembly Solutions.
Key features of the system include:
• Automatic AOI program generation.
• AI-powered, library-free inspection.
• Inspection program based on first assembled board.
• Full metrology inspection offering inspection traceability.
GenI is currently the only solution on the market offering all-in-one zero programming, true 3D measurement, and traceability.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...UV curing oven for high-efficiency PCB production Techmet
Manufacturing / Production Technology, Hardware & Services
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.
Read more...Automatic stencil cleaning ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.