Tiny SoM integrates NXP i.MX 91
29 May 2026
AI & ML
Direct Insight can now deliver and support development for the new QS91, featuring NXP’s i.MX 91 applications processor, which delivers an optimised blend of security, features, and energy-efficient performance for the next generation of Linux-based IoT and industrial applications.
The QS91 is a tiny solderable computer module, measuring just 27 x 27 mm, with 2,6 mm total height in a single-sided assembly. Its QFN-style lead style design has a 1 mm pitch with 100 pads – and in addition to providing EMC-compliant signal routing, the ground pad on the bottom side is also used for heat transfer, ensuring highly efficient thermal characteristics.
The SoM’s i.MX 91 applications processor is powered by a single-core 64-bit ARM Cortex-A55, running at 1,4 GHz. Display support is simplified by the RGB parallel display interface, while a wide range of connectivity is supported, including dual USB, CAN-FD, and Gigabit Ethernet. The module adds 512 MB LPDDR4 RAM and 4 GB eMMC Flash memory to supply the processor.
NXP’s Edgelock secure enclave provides a silicon root of trust and robust security architecture to help protect edge devices against physical and network attacks.
For more information visit www.directinsight.co.uk
Further reading:
High-performance module for physical AI applications
Avnet Silica
AI & ML
congatec has introduced its new COM-HPC Client Size C module with AMD Ryzen AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications.
Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...
SoC brings scalable edge AI to life
Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...
Wall-mount cooling for Edge IT
AI & ML
Designed to run 24/7 in critical compute environments, Vertiv CoolPhase Wall delivers up to 60% greater airflow than comfort cooling.
Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...
Edge AI improves condition monitoring
EBV Electrolink
AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.
Read more...
Robotics platform powers intelligent systems
Vepac Electronics
AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
Read more...
SensorGPT speeds intelligent IoT deployment
AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
Read more...
Ideal entry point into edge AI
Avnet Silica
AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
Read more...
Analogue reservoir AI chip capable of real-time learning
Altron Arrow
AI & ML
TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University.
Read more...