31 July 2026Manufacturing / Production Technology, Hardware & Services
Mycronic’s BA 01 small dot ejector, engineered for the MY700 jet printer, delivers unmatched precision in solder paste jet printing for advanced PCB designs.
This new capability can accommodate the fine print of solder paste deposits from 180 to 330 micrometer in diameter with a volume ranging from 1 to 4 nanoliter. This innovation reduces the risk of overprinting, solder bridging, and solder balls, ultimately leading to higher product yields. The ejector also supports pitch sizes down to 0,3 mm, addressing the trend toward ever-smaller component pitches in modern electronics.
Unlike fixed-volume size solutions that require nozzle changes or multiple dispense valves, Mycronic’s new ejectors offer software-controlled variability, delivering the multiple dot and volume size using only one applicator. The small dot ejector is engineered for manufacturers who want to achieve both high precision and yield.
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JAPAN UNIX has published a new event report and highlight video from their UNIX SOLDERING DAY 2026 in Hungary. This event reflects on their commitment to supporting manufacturers not only through soldering automation systems, but also through technical education, live demonstrations, hands-on training, and practical engineering know-how.
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The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.
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