DSP, Micros & Memory


Industrial-grade ESP32-S3 controller

31 July 2026 DSP, Micros & Memory

Erqos Technologies recently introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation, monitoring, and connected-device applications. The EQSP32CE brings Ethernet, Wi-Fi, MQTT, protected industrial I/O, field wiring, DIN-rail mounting, CE certification, and a full expansion-module ecosystem to the ESP32 platform, eliminating the shields, add-on boards, carrier boards, and custom wiring typically needed to turn prototypes into production-ready systems.

Unlike typical ESP32 and microcontroller development boards, which are designed for prototyping rather than deployment, the EQSP32CE integrates the requirements of real industrial installations: DIN-rail mounting, a wide-range industrial power supply, protected field wiring, surge and transient protection, service-friendly connectors, and full CE certification. These are the barriers that normally prevent maker-class hardware from being installed in electrical panels or machinery. The EQSP32CE removes those barriers, while keeping the openness of the ESP32-S3 platform, giving developers a controller that can move directly from the bench to the field without redesigning hardware or adding external protection modules.

For industrial communication, the EQSP32CE includes protected RS485, RS232, and CAN bus interfaces. This integration eliminates the need for external transceiver hats, protection circuits, and custom wiring that development boards normally require to survive electrical noise, grounding differences, and high-energy transients. The EQSP32CE supports Modbus RTU, DMX512, custom serial protocols, and CAN-based machine communication.

All 16 terminals can operate as digital inputs or solid-state outputs, while the first eight also support analogue modes including 0–10 V, 4–20 mA, relative analogue input, and thermistor temperature sensing. This lets developers reconfigure hardware in software as the project evolves.

At its heart, the EQSP32CE uses a dual-core 240 MHz ESP32-S3 with 8 MB of Flash and 512 kB of RAM. Developers can use Arduino, ESP-IDF, or VS Code with PlatformIO, with full access to the ESP32 ecosystem of open-source libraries, examples, and tools. The EQSP32CE also introduces EQ-AI, a generative development system built for embedded programmers. Developers can describe behaviour in plain language or simple step-based logic, and EQ-AI produces hardware-aware C++ code for the EQSP32CE, handling MQTT topics, JSON payloads, network setup, reconnection logic, diagnostics, and REST endpoints automatically. Because the output is standard C++, it can be reviewed, modified, and integrated directly into Arduino, ESP-IDF, or VS Code with PlatformIO projects.

For more information visit www.erqos.com




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...
Compact MCU for IoT endpoints
iCorp Technologies DSP, Micros & Memory
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved