Interconnection


56 G MezzaWave connectors and cable assemblies

31 August 2026 Interconnection


Engineered to deliver notable signal integrity, TE’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular systems.

The series provides design flexibility with a 1,27 mm pitch option, pin counts ranging from 80 to 560, and 7-10 mm stack heights. It also features drop-in compatibility, enabling the direct replacement of existing components without redesign.

By combining advanced ball grid array (BGA) technology with a ruggedised mechanical design, MezzaWave connectors reliably support high-speed data transmission and are rated for up to 1000 mating cycles and a wide operating temperature range from -55°C to 125°C. These connectors meet

VMEbus International Trade Association (VITA) and American National Standards Institute (ANSI) standards and provide superior routing and grounding flexibility for optimised system performance.

For more information contact Electrocomp, +27 11 458 9000, sales@electrocomp.co.za, www.electrocomp.co.za




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