Manufacturing / Production Technology, Hardware & Services


Electronic assembly cleaning agents

20 February 2013 Manufacturing / Production Technology, Hardware & Services

Available from Techspray are cleaning agents for various parts of the electronic assembly process.

Eco-Stencil UM is a manual and under-stencil cleaner that effectively removes all types of solder paste and uncured adhesive from screens, misprinted boards and equipment. It is completely safe on stencils, squeegees and equipment surfaces.

Applications include manual stencil tool, work surface and squeegee cleaning, automatic underside wipe stencil cleaning, removing unsoldered leaded and lead-free solder pastes, and cleaning off uncured adhesives.

Eco-Stencil UM is an ideal replacement for IPA cleaners, which are often prohibited because of safety, environmental restrictions on VOC emissions, or waste disposal issues. Convenient pre-saturated wipes are available in a pop-up dispenser; the wipe material is lint-free and resistant to tearing and shredding.

By contrast, Eco-Oven cleans reflow ovens, wave soldering systems, associated heat exchanger systems, wave fingers and solder pallets by removing all types of flux residues. It is best used for periodic preventative maintenance to keep equipment performing at peak levels. It is fast acting and more effective than IPA for baked-on flux residues.

Finally, leveraging the cleaning power of pine, Pine-Shower surface and equipment cleaners quickly removes flux residues, grease and other soils, and leaves a non-oily finish. It is safe on ESD-safe mats, workbenches and equipment surfaces. Pine-Shower does not contain butyl cellosolve, which is an unhealthy ingredient in many degreasers and surface cleaners. It is also free of ionics and silicones that can contaminate PCBs and lead to board failure.



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