IPC issues revised BGA guideline
6 March 2013
News
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high-density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Published by IPC and developed with input from representatives from OEMs, fabricators, EMS companies and others in the electronics manufacturing industry, IPC-7095C addresses design and process considerations of particular importance to portable handheld products in which BGAs are a dominant interconnection technology.
A notable addition to the revised document is its inclusion of expanded information on mechanical failure issues such as PCB pad cratering or laminate defects that occur after assembly. In addition to providing guidelines for BGA inspection and repair, it addresses reliability issues and the use of lead-free joint criteria associated with BGAs.
IPC-7095C also features numerous photographs of X-ray and endoscope illustrations to identify various defect conditions such as head-on-pillow, an incomplete and unreliable condition that can occur during BGA assembly processes.
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