New from Texas Instruments is a high-temperature, non-volatile Flash memory device for harsh environments. The SM28VLT32-HT has an operational capacity of 4 MB and eliminates the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications.
The device allows data-logging at extreme temperatures and is guaranteed for at least 1000 hours of operating life in harsh environment applications, including oil and gas exploration, heavy industrial and avionics. It is qualified to work in temperatures ranging from -55°C to +210°C.
The device is available in an 8 x 25 mm ceramic flat pack and an evaluation module is available on a ruggedised board to allow for evaluation at high temperatures.
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With Avocado OS now available on the HummingBoard RZ-V2N-
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The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
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As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
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