The new BeagleBone Black announced by Texas Instruments is a credit-card-sized Linux computer aimed at developers, makers, hobbyists and students, and is selling for just $45 – half the price of the original BeagleBone.
The pricing and specifications of the new board clearly position it as a competitor to the more established Raspberry Pi. Although the marketing material does not come out and say as much, it does include snippets like 'Everything you need to go from box to developing in less than 3,14 minutes' – 3,14 being equal to pi, of course.
It also points out that the Texas Instruments Sitara AM335x processor onboard the BeagleBone Black boasts double the performance of ARM11-based solutions, and indeed, the Raspberry Pi is based on an ARM11 processor core.
BeagleBone Black is based on the 1 GHz Sitara AM335x ARM Cortex-A8 processor and includes 2 GB of onboard storage to run pre-loaded Linux software, as well as a USB cable to power the board. Featuring USB, Ethernet and HDMI interfaces, the board has the interfaces to connect to a wide variety of devices such as a mouse, keyboard or LCD display. It offers designers flexibility with expansion headers, including 65 digital I/Os, seven analog inputs and access to a variety of analog and digital peripherals.
The system comes pre-loaded with a Linux operating system and Cloud9 IDE to kickstart development and keep the microSD slot available for additional storage. The software is optimised to help new users explore embedded Linux and become proficient quickly. The ecosystem includes free access to documentation, example code and mainline kernel support for other software distributions like Ubuntu, Android and Fedora. BeagleBone Black’s kernel and driver flexibility allows users to easily integrate new hardware and software.
More than 30 plug-in boards, called ‘capes’ by the community, are compatible with BeagleBone Black, with more capes to come. Integrating BeagleBone Black with these capes – such as 3D printers, a DMX lighting controller, a Geiger counter, a telerobotic submarine, LCD touch screens and more – extends the functionality of the board and accelerates the development process.
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...Siemens acquires Canopus AI ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.