TDK has developed a miniaturised multilayer chip bead series in case size 0603 (EIA 0201) that is nearly 80% smaller in volume and 65% in area than existing MMZ1005-E types with comparable performance.
The new MMZ0603-E series features compact dimensions of just 0,6 x 0,3 x 0,3 mm and is currently available in two high-impedance versions, one rated for 600 Ω and the other for 1000 Ω at 100 MHz. Both types offer even higher impedance values at 1 GHz of 1000 Ω and 1800 Ω, respectively.
Thanks to its very good impedance values, a single component can cover a very wide frequency range, ensuring highly efficient noise attenuation. The chip bead is therefore very well suited for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands.
The advance in the miniaturisation of chip beads was made possible by TDK’s Gigaspira production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals.
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