TDK has developed a miniaturised multilayer chip bead series in case size 0603 (EIA 0201) that is nearly 80% smaller in volume and 65% in area than existing MMZ1005-E types with comparable performance.
The new MMZ0603-E series features compact dimensions of just 0,6 x 0,3 x 0,3 mm and is currently available in two high-impedance versions, one rated for 600 Ω and the other for 1000 Ω at 100 MHz. Both types offer even higher impedance values at 1 GHz of 1000 Ω and 1800 Ω, respectively.
Thanks to its very good impedance values, a single component can cover a very wide frequency range, ensuring highly efficient noise attenuation. The chip bead is therefore very well suited for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands.
The advance in the miniaturisation of chip beads was made possible by TDK’s Gigaspira production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals.
Coupled inductor for high-performance applications
Passive Components
This coil with MnZn core is characterised by its high permeability and extremely low RDC values, which achieves excellent power density and very high efficiency.
Read more...Track with precision Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.
Read more...RGBIR sensor with I2C interface Electrocomp
Opto-Electronics
Available in a miniature opaque 2,67 x 2,45 mm package, Vishay’s VEML6046X00 includes high-sensitivity photodiodes, a low noise amplifier, and a 16-bit analogue to digital converter.
Read more...Power inductors iCorp Technologies
Passive Components
he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
Read more...SMT power inductors Future Electronics
Passive Components
The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.
Read more...Large capacitance MLCCs at 100 V RS South Africa
Passive Components
TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors to 10 µF at 100 V in 3225 size.
Read more...Film and mica capacitors Actum Electronics
Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Read more...Power-over-coax inductors RS South Africa
Passive Components
TDK has expanded the ADL3225VF series of wire-wound inductors for automotive power-over-coax (PoC).
Read more...Thick film power resistors Electrocomp
Passive Components
Vishay has released a new product to the market, its thick film power resistor, which is offered in a clip-mount TO-247 package.
Read more...Compact EMI suppression capacitors RS South Africa
Passive Components
These new components from TDK are 20% smaller than previous models and meet Grade III Test B standards for temperature, humidity, and bias.
printer friendly version