7 August 2013Manufacturing / Production Technology, Hardware & Services
Mirtec premiered its new MV-9 AOI systems at NEPCON China earlier this year. The MV-9 2D/3D CoaXPress in-line AOI systems are configured with the company’s Omni-vision 3D inspection technology that combines 25 megapixel 2D inspection with advanced digital multi-frequency moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.
Mirtec’s CoaXPress camera technology is capable of providing data transfer rates of 25 Gbit/second while its advanced six phase lighting system uses multi-colour LEDs to illuminate inspection areas from six different angles, providing enhanced solder joint characterisation and co-planarity inspection of leads on gull-wing devices.
The system’s quad moiré technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four 4 moir&233; inspection probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
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At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
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Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
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The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
Read more...Inline vapour phase soldering for high-volume production MyKay Tronics
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The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
Read more...Global electronics solutions since 1964 IMP Electronics Solutions
Manufacturing / Production Technology, Hardware & Services
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
Read more...Driving excellence in electronics manufacturing Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.
Read more...When do you need Nitrogen in reflow? Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
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