7 August 2013Manufacturing / Production Technology, Hardware & Services
Mirtec premiered its new MV-9 AOI systems at NEPCON China earlier this year. The MV-9 2D/3D CoaXPress in-line AOI systems are configured with the company’s Omni-vision 3D inspection technology that combines 25 megapixel 2D inspection with advanced digital multi-frequency moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.
Mirtec’s CoaXPress camera technology is capable of providing data transfer rates of 25 Gbit/second while its advanced six phase lighting system uses multi-colour LEDs to illuminate inspection areas from six different angles, providing enhanced solder joint characterisation and co-planarity inspection of leads on gull-wing devices.
The system’s quad moiré technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four 4 moir&233; inspection probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
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Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.
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The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
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At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
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