7 August 2013Manufacturing / Production Technology, Hardware & Services
Mirtec premiered its new MV-9 AOI systems at NEPCON China earlier this year. The MV-9 2D/3D CoaXPress in-line AOI systems are configured with the company’s Omni-vision 3D inspection technology that combines 25 megapixel 2D inspection with advanced digital multi-frequency moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.
Mirtec’s CoaXPress camera technology is capable of providing data transfer rates of 25 Gbit/second while its advanced six phase lighting system uses multi-colour LEDs to illuminate inspection areas from six different angles, providing enhanced solder joint characterisation and co-planarity inspection of leads on gull-wing devices.
The system’s quad moiré technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four 4 moir&233; inspection probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
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