Designed with input from the engineering and maker communities, Texas Instruments unveiled the new MSP430 USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for its portfolio of USB microcontrollers.
Together with the added functionality of TI’s new near field communication (NFC) BoosterPack and NFCLink library, the company is providing a starting point for developers to tap into what’s being called the Internet of Things (IoT).
The MSP-EXP430F5529LP LaunchPad, based on the ultra-low-power MSP430F5529 microcontroller (MCU), provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications.
To ease development, TI’s MSP430 USB portfolio includes the comprehensive MSP430 USB Developers Package which contains free and open source USB API stacks, source code, sample applications and a code-gen tool to quickly configure USB applications for all MSP430 USB microcontrollers.
Based on the TRF7970A NFC transceiver, the DLP7970ABP NFC BoosterPack gives developers a quick and easy connection via NFC. TI’s existing Wi-Fi, sub-1 GHz and ZigBee BoosterPacks can also easily plug into the MSP430 USB LaunchPad to enable wireless connectivity to smart home and building, health and fitness, and portable consumer applications.
The new MSP-EXP430F5529LP LaunchPad includes support for Energia. This community-developed, open source integrated development environment (IDE) based on the Wiring framework enables code compatibility across TI’s Energia-supported MCU LaunchPads and BoosterPacks including the new NFC BoosterPack and recently announced SimpleLink Wi-Fi CC3000 BoosterPack.
Edge AI improves condition monitoring EBV Electrolink
AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.
Read more...Advanced STM32 debugging in VS Code
Design Automation
Once an STM32 project is running in VS Code, the IAR C-SPY Debug extension adds a professional-grade analysis layer that scales with project complexity.
Read more...Industrial time-of-flight proximity sensor EBV Electrolink
Opto-Electronics
STMicroelectronics’ VL53L4ED is a compact, high accuracy time-of-flight proximity sensor designed for industrial and embedded applications that require precise short range distance measurement.
Read more...Introducing STM32CubeMX2 Altron Arrow
Design Automation
STMicroelectronics has launched STM32CubeMX2, a new evolution of its popular configuration and code generation tool for STM32 microcontrollers.
Read more...Ultra-low-power smart metering EBV Electrolink
Analogue, Mixed Signal, LSI
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs.
Read more...AI assistant for STM32 developers
Design Automation
The STMicroelectronics STM32 Sidekick is an AI-driven assistant fully integrated into the STM32 ecosystem designed to streamline embedded development using STM32 microcontrollers.
Read more...High-performance SSD storage EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
Targeting the performance segment, the new KIOXIA XG10 Series leverages PCIe 5.0 technology to significantly elevate speed and responsiveness across data-intensive client applications.
Read more...Next-gen robotic systems initiative EBV Electrolink
Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.