Designed with input from the engineering and maker communities, Texas Instruments unveiled the new MSP430 USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for its portfolio of USB microcontrollers.
Together with the added functionality of TI’s new near field communication (NFC) BoosterPack and NFCLink library, the company is providing a starting point for developers to tap into what’s being called the Internet of Things (IoT).
The MSP-EXP430F5529LP LaunchPad, based on the ultra-low-power MSP430F5529 microcontroller (MCU), provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications.
To ease development, TI’s MSP430 USB portfolio includes the comprehensive MSP430 USB Developers Package which contains free and open source USB API stacks, source code, sample applications and a code-gen tool to quickly configure USB applications for all MSP430 USB microcontrollers.
Based on the TRF7970A NFC transceiver, the DLP7970ABP NFC BoosterPack gives developers a quick and easy connection via NFC. TI’s existing Wi-Fi, sub-1 GHz and ZigBee BoosterPacks can also easily plug into the MSP430 USB LaunchPad to enable wireless connectivity to smart home and building, health and fitness, and portable consumer applications.
The new MSP-EXP430F5529LP LaunchPad includes support for Energia. This community-developed, open source integrated development environment (IDE) based on the Wiring framework enables code compatibility across TI’s Energia-supported MCU LaunchPads and BoosterPacks including the new NFC BoosterPack and recently announced SimpleLink Wi-Fi CC3000 BoosterPack.
Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...AMD Vivado Design Suite 2025.1
Design Automation
AMD Vivado Design Suite 2025.1 is here, and now with support for AMD Spartan UltraScale+ and next-generation Versal devices.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Webinar: Designing in a connected environment
Design Automation
With Altium Designer and its data management platform, the team will always be up to date with the latest design documents and be able to comment on schematic, PCB, BOM and assembly drawings.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...ST’s graphical no-code design software
Design Automation
MEMS-Studio is a complete desktop software solution designed to develop embedded AI features, evaluate embedded libraries, analyse data, and design no-code algorithms for the entire portfolio of ST’s MEMS sensors.
Read more...LibGSM – A powerful, modular GSM library eiTech Systems
Design Automation
Whether you are building SMS, MQTT, HTTP or other GSM-based applications, eiTech’s LibGSM library helps streamline development with its carefully structured design.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version