Design Automation


New TI LaunchPad targets the Internet of Things

9 October 2013 Design Automation

Designed with input from the engineering and maker communities, Texas Instruments unveiled the new MSP430 USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for its portfolio of USB microcontrollers.

Together with the added functionality of TI’s new near field communication (NFC) BoosterPack and NFCLink library, the company is providing a starting point for developers to tap into what’s being called the Internet of Things (IoT).

The MSP-EXP430F5529LP LaunchPad, based on the ultra-low-power MSP430F5529 microcontroller (MCU), provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications.

To ease development, TI’s MSP430 USB portfolio includes the comprehensive MSP430 USB Developers Package which contains free and open source USB API stacks, source code, sample applications and a code-gen tool to quickly configure USB applications for all MSP430 USB microcontrollers.

Based on the TRF7970A NFC transceiver, the DLP7970ABP NFC BoosterPack gives developers a quick and easy connection via NFC. TI’s existing Wi-Fi, sub-1 GHz and ZigBee BoosterPacks can also easily plug into the MSP430 USB LaunchPad to enable wireless connectivity to smart home and building, health and fitness, and portable consumer applications.

The new MSP-EXP430F5529LP LaunchPad includes support for Energia. This community-developed, open source integrated development environment (IDE) based on the Wiring framework enables code compatibility across TI’s Energia-supported MCU LaunchPads and BoosterPacks including the new NFC BoosterPack and recently announced SimpleLink Wi-Fi CC3000 BoosterPack.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Highly integrated 24-channel mixed signal IC
EBV Electrolink DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.

Read more...
Touch-enabled 32-bit MCU
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
ST welcomes STM32Cube AI Studio
Design Automation
STMicroelectronics has introduced STM32Cube AI Studio, a new desktop software environment designed to simplify the deployment of artificial intelligence on STM32 microcontrollers.

Read more...
NeoCortec introduces new NeoGW software
Design Automation
This is a powerful multiplatform open-source solution designed to streamline integration between the NeoMesh network and upper-level systems, whether deployed in the cloud or on-premise environments.

Read more...
Keil Studio now in VSCode
Design Automation
Keil Studio, Arm’s latest IDE, now integrates embedded development tools directly into Visual Studio Code providing features like seamless industry tool integration, version control, and a CLI for CI workflows.

Read more...
Advanced pressure monitoring sensor
EBV Electrolink Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.

Read more...
Quad-Apollo MxFE reference design
Design Automation
The Quad-Apollo MxFE reference design exemplifies a complete, high-performance platform for every-element direct-RF sampling digital beamforming using Analog Devices’ Apollo mixed-signal front-end technology.

Read more...
High-efficiency 600 V power MOSFET
EBV Electrolink Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.

Read more...
High-performance FPGA family
EBV Electrolink DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.

Read more...
MIKROE signs multi-year deal with Renesas
Dizzy Enterprises Design Automation
MIKROE has signed a multi-year MCU development tool support deal with Renesas, which commits MIKROE to providing development tools for 500 of Renesas’ most popular MCUs.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved