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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

High-strength thermal adhesive
23 October 2013, Manufacturing / Production Technology, Hardware & Services

Bergquist has introduced Liqui-Bond SA 3505 high thermal conductivity adhesive, which helps save the costs and time associated with clip or screw fastening of heatsinks in power supplies and discrete applications. The two-part liquid adhesive can be stored without refrigeration, and achieves high bond strength after heat curing.

Liqui-Bond SA 3505 has thermal conductivity of 3,5 W/m-K and displays shear strength of 3,15 MPa when cured. Its high bond strength allows use for many purposes including PCB attachment, providing a fast and easy-to-use alternative to conventional fixings.

In addition, mild elastic properties help alleviate coefficient of thermal expansion (CTE) stresses during thermal cycling. For applications where a consistent standoff or dielectric integrity is critical, Liqui-Bond SA 3505 can be ordered with 0,18 mm or 0,25 mm glass beads.

The adhesive’s thixotropic properties promote easy flowing during assembly with minimal stress on fragile components, and ensure the deposit will remain in place until cured. Its shear thinning characteristics support optimised dispensing, while availability in cartridge or kit form allows use with either manual or automated dispensing equipment.

For more information visit www.bergquistcompany.com


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