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High-speed backplane connectors
19 February 2014, Interconnection

TE Connectivity’s new Impact backplane connector system is designed for increased speed and density to meet the future system upgrades and next-generation requirements of data networking and telecommunications equipment.

The system incorporates a unique broad-edge coupled design which utilises a low-impedance, localised ground return path in an optimised differential pair array. Additionally, differential pairs are tightly coupled and surrounded by ground structures to isolate the pairs, which in turn reduces crosstalk and increases overall bandwidth performance with minimal performance variance.

Backplane header construction on the Impact connector offers air pockets selectively placed in the header floor to isolate signal pairs. The header signal pins are straight with no forms or offsets, which increases the mechanical strength of the pins. The mating interface features a bifurcated beam with two points of contact, with the second staggered 1 mm behind the first for maximum reliability.

The Impact connector offers two different hole sizes and tail lengths, with the smaller one providing optimal electrical performance. The larger hole size is ideal for backplane applications that have a slightly larger plate through-hole and pin length for manufacturability of the printed circuit board.


Credit(s)
Supplied By: Electrocomp
Tel: +27 11 458 9000
Fax: +27 11 458 9034/5
Email: andrew@electrocomp.co.za
www: www.electrocomp.co.za
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