23 April 2014Manufacturing / Production Technology, Hardware & Services
Viscom’s new S3088 Ultra 3D-AOI system combines the flexibility of the AOI systems of the company’s S3088 family with the strengths of the high-performance XM-3D camera module. The S3088 AOI systems are designed to flexibly cover various requirements, from small series production to high-volume/low-mix manufacturing. The XM-3D camera module allows especially fast inspections, with both high-resolution angled views and 3D analyses.
With the XM-3D camera module, the Viscom S3088 Ultra achieves image data rates up to 1,8 gigapixels per second. As an additional benefit, it offers all the possibilities of 3D measurement technology in the XM-3D sensor head. It works with an integrated structured light projector for image fields of up to nine views. This permits exact 3D analyses of for example lifted leads, surface chips or IC co-planarity defects.
Through high-resolution angled views, the new machine reliably recognises critical defects. With the OnDemandHR function, the optical resolution of 16 μm (standard resolution) can be converted to 8 μm (high resolution). In this way, the system is also able to reliably check 03015 type components.
Offering all the features of the Viscom S3088 family, the S3088 Ultra’s fast computer and touch screen ensure high computing performance and simple, fast operation. Additionally, the new AOI system is designed both for the inspection software vVision and for EasyPro.
A further highlight is the Viscom FastFlow transport which achieves very high throughput in printed circuit board handling. Electronic assemblies can be fed in and out synchronously. Additionally, with a width of just under 1 metre and a depth of somewhat over 1,5 metres, the system is especially compact.
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