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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

High-speed component mounters
23 April 2014, Manufacturing / Production Technology, Hardware & Services

JUKI recently unveiled the JX series of high-speed, modular component mounters, which are designed to be compact and improve productivity per area of a packaging factory by 58%.

The RX-6 is a highly flexible machine that can place on PWBs a wide variety of components from chip packages such as subminiature components to large IC components or odd-shaped components. The RX-6 adopts the features of the KE Series but improves component placement speed and reduces size.

Because this mounter is equipped with head units that pick up components and place them on PWBs on both the rear and front sides, the head units on the front and rear sides repeat picking up and placing components in turn, reducing loss of work and almost doubling productivity. Additionally, applicable IC component height and the supported PWB size is increased, allowing the machine to support various types of production such as mounting of LEDs or package-on-package.

The machine is equipped as standard with a placement monitor/analyse function which captures a picture of a pick-up/placement of a component to allow the operator to monitor the mounting process in detail.

The RX-7 mounter places mainly subminiature components on PWBs at high speed. While the size and weight of the machine are reduced, it has two ‘super rotary heads’ equipped with 16 nozzles for picking up/placing each component on a PWB. This feature achieves performance of 75 000 components per hour.

A parallel head configuration is used for the heads, which also serves to improve the production capability of the mounter. Additionally, a camera installed inside the head detects a tombstone problem or component absence to realise high-speed and high-quality component placement.


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Supplied By: Allan McKinnon & Associates
Tel: +27 11 704 3020
Fax: 086 555 0111
Email: info@testerion.co.za
www: www.ama-sa.co.za
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Further reading:

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    According to experts, between 60 and 70% of all defects and failures during or after the soldering process are attributable to defects in the printing process (Figure 1). In general, these are faulty ...
  • What you need to know about the Hermes standard
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    Taking advantage of modern TCP/IP communication and XML data format technologies, Hermes is effectively a replacement of the more than 20-year-old SMEMA standard.

 
 
         
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