New from Diamond Systems is Quantum, a conduction cooled PCI/104-Express SBC (single board computer) family with interchangeable, full size QSeven COMs processors and a highly integrated I/O baseboard. The processors available on the platform include the 1 GHz AMD Fusion G-T40E CPU, the 1 GHz AMD G-Series eKabini GX-210HA SOC and ARM A9 i.MX6 single/dual/quad cores up to 1,2 GHz.
The SBCs fully utilise the latest serial high-speed buses available with QSeven for extended product viability as well as the concept’s modular plug and play function that enhances performance scalability. They offer a wide range of onboard I/O including data acquisition with A/D, digital I/O, counter/timers and pulse width modulators.
Standard PC I/O includes USB 2.0, RS-232/422/485, Gigabit Ethernet, SATA and digital I/O.
Designed to cope in harsh environments including industrial, on-vehicle and military applications, the boards feature a bottom-side heat spreader that mounts directly to the baseboard, relieving stress on the Qseven module and enhancing durability. Most I/O is provided on latching connectors for increased ruggedness. The boards also incorporate a 6 V to 34 V power input.
Quantum SBCs support I/O expansion with PCI-104, PCIe/104 and PCI/104-Express I/O modules. A new miniature, low-cost PCIe connector supports both PCIe/104 Type 1 and Type 2 modules and provides compatibility with existing PCIe/104 I/O modules.
For additional I/O expansion, Quantum also provides a dual-use PCIe MiniCard/mSATA socket. I/O modules featuring WiFi, Ethernet, analog I/O, digital I/O and CAN are available in the PCIe MiniCard form factor. For rugged applications, wide-temperature mSATA modules up to 64 GB are available in SLC and MLC technologies.
Quantum SBCs run Linux, Windows Embedded Standard 7 and Windows XP operating systems. A Linux software development kit is available with bootable images and drivers to facilitate the start of a design project right out of the box.
The system was designed with rugged applications in mind, from its extended operating temperature of -40°C to +85°C on most models and the onboard DDR3 SDRAM, to the latching I/O connectors. The bottom-mounted heat spreader simplifies the installation of I/O modules on the top side of the board, eliminating interference from heatsinks and increasing space for I/O functions and connectors.
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