Manufacturing / Production Technology, Hardware & Services


High-speed solder paste printer

16 July 2014 Manufacturing / Production Technology, Hardware & Services

The new MY600 jet printer from Mydata allows SMT producers to achieve high-precision solder joints at speeds of more than one million dots per hour.

Increasingly, the jet printing of solder paste onto PCBs is being used at all levels of the industry to cope with complex broadband and mixed technology boards, among other factors. Originally intended for NPI or low-volume production, jet printers are in ever greater demand for applications in high-volume series manufacturing.

A completely non-contact, software-driven technology, the MY600 overcomes many of the speed and quality limitations posed by screen printing and traditional solder paste dispensers, enabling operator-independent production of series of any size, at high speeds. The machine is ideal for handling flexible substrates, board cavities, package-on-package, QFNs and new components with small process windows.

The ability to control dot volume, diameter and deposit repeatability is crucial to ensuring that each pad receives the optimal amount of paste and trustworthy solder joint quality. Small dots allow for higher precision jetting and customised 3D build-up, while larger dots let the jetting head move more quickly, improving board throughput. The printer allows the operator to easily adjust solder paste volume and shape for each individual pad on the printed circuit board.



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