1 January 2015
Manufacturing / Production Technology, Hardware & Services
The Multicore portfolio of cored solder wire features award-winning multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers ease of use and outstanding performance for today’s delicate hand soldering assembly and rework operations.
The fluxes in the solder wires have been formulated to accommodate a wide variety of different alloys and diameters. Multicore cored wires support both traditional tin-lead manufacturing, as well as modern lead-free processes, including point-to-point robotic soldering. Their fast wetting materials deliver consistently excellent solder joint integrity.
Multicore solder wire can be supplied in several diameters between 0,23 mm and 1,63 mm, spun on 250 g, 500 g and 1000 g rolls.
20 years of precision, progress and purpose – the Jemstech journey Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...An argument to redefine IPC class definitions for class 1, 2, & 3 electronics MyKay Tronics
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One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...Large platform stencil printer Techmet
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GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...Press-fit component inspection MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...A new era in wire bond inspection Techmet
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Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
Read more...Mycronic’s MYPro A40 pick-and-place solution MyKay Tronics
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Mycronic’s MYPro A40 pick-and-place solution, equipped with an MX7 high-speed mounthead technology, increases top placement speeds by 48% over the previous generation.
Read more...Why ergonomics matters in digital microscopy TANDM
Manufacturing / Production Technology, Hardware & Services
While magnification technology has kept pace with demand, the wellbeing of the people behind the microscopes has often been overlooked with technicians spending long hours in intense focus, leading to chronic strain, fatigue, and costly mistakes.
Read more...From ER to effortless: The 15-year journey of Seven Labs Technology Seven Labs Technology
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What started as a business likened to an ‘ER’ for electronic components has today grown into a trusted partner delivering kitting services and full turnkey solutions – taking the effort out of electronics and helping customers truly ‘Move to Effortless.’
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