Computer/Embedded Technology


SBC in PC/104-Plus format

8 April 2015 Computer/Embedded Technology

Diamond Systems unveiled its rugged, highly integrated Aries single-board computer (SBC) based on the Intel E3800 ‘Bay Trail’ processor family. Designed in the PC/104-Plus form factor with wings (114 x 102 mm), the board’s full rectangular shape provides extensive coastline for I/O connectors.

Available configurations include the E3845 1,91 GHz quad-core processor and the E3826 1,46 GHz dual-core processor, with a choice of 2 GB or 4 GB soldered memory. Dual independent displays are supported, with connections for dual channel 24-bit LVDS LCD, VGA, DisplayPort and HDMI.

Available I/O includes three USB 2.0 ports (one of which can operate as USB 3.0), four RS-232/422/485 ports with fully programmable configuration, dual Gigabit Ethernet, and a SATA port that supports both onboard SATA DOM and off-board SATA devices.

Optional integrated data acquisition includes sixteen 16-bit A/D channels with 250 kHz sample rate, four 16-bit D/A channels with voltage and current outputs, a programmable waveform generator, and 22 programmable digital I/O lines, all supported by Diamond’s free Universal Driver data acquisition programming library. An interactive, easy to use graphical control panel for Windows and Linux is provided to control all data acquisition features.

Aries supports stackable I/O expansion with PC/104 (ISA) and PC/104-Plus (ISA + PCI) I/O modules. It also provides a dual-use PCIe MiniCard / mSATA socket for additional I/O expansion. PCIe MiniCard I/O modules featuring Wi-Fi, Ethernet, analog I/O, digital I/O and CAN are available from Diamond Systems and other vendors, enabling compact expandability without increasing the total height of the system.

The system’s built-in heat spreader efficiently removes heat from the SBC directly to the system enclosure and helps keep the interior cooler for improved reliability. The novel bottom-side mounting configuration of the heat spreader provides a convenient mounting system for the board, as well as simplifying the installation of topside I/O expansion modules by eliminating interference or airflow problems that can occur with traditional heatsinks. A heatsink accessory option can be installed to use the board in a traditional heatsink style installation.

The Aries SBC family was designed with rugged applications in mind. With an operating temperature of -40°C to +85°C, memory soldered onboard, an integrated heat spreader thermal solution, 50% thicker PCB, and latching I/O connectors, it is well adapted for rugged applications including industrial, medical, on-vehicle and military. It is also available in Diamond’s off-the-shelf hardened and highly configurable Raptor systems for extremely rugged, mission-critical applications.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

AMD Xilinx online training: Vivaldo ML tools
EBV Electrolink Computer/Embedded Technology
The webinar will explore the features of SystemVerilog that are useful for RTL synthesis using Vivado ML Tools and how the RTL SystemVerilog language constructs have been optimised for productivity and reliability.

Read more...
Galleon releases a rugged 100GbE recorder
Rugged Interconnect Technologies Computer/Embedded Technology
The XSR 100GbE recorder is the latest addition to Galleon Embedded Computing’s line-up of innovative military embedded solutions and is perfect for applications in unmanned systems, surveillance and reconnaissance.

Read more...
Samsung launches GDDR6 RAM module
EBV Electrolink Computer/Embedded Technology
The DRAM is capable of 24 Gbps processing speeds and will significantly advance the graphics performance of AI-based applications and high-performance computing.

Read more...
Qualcomm AI stack: a unified AI software solution
Future Electronics Computer/Embedded Technology
Qualcomm has bundled all its AI software offerings into a single package called the Qualcomm AI Stack which will assist developers in deploying AI applications.

Read more...
ADLINK launches NVIDIA Jetson-based vision system
Rugged Interconnect Technologies Computer/Embedded Technology
The EOS-JNX-I is a next-generation AI vision system that uses the new NVIDIA module as an optimised development platform that simplifies AI to the edge.

Read more...
Quectel announces high-performance 5G smart module
iCorp Technologies Computer/Embedded Technology
The SG560D, an Android smart module that combines 5G and artificial intelligence, is suitable for complex applications such as in-vehicle infotainment and industrial handheld devices.

Read more...
Half-duplex transceiver for RS-485
Vepac Electronics Computer/Embedded Technology
The new enhanced transceiver is designed for RS-485 data bus networks and is fully compliant with the TIA/EIA-485A standard.

Read more...
ST releases first automotive IMU with embedded ML
Altron Arrow Computer/Embedded Technology
Smart driving moves another step closer to high levels of automation with STMicroelectronics’ new machine learning core.

Read more...
Rugged plug-in card ideal for sensor-based systems
Rugged Interconnect Technologies Computer/Embedded Technology
Concurrent Technologies’ new processor board provides high performance for I/O sensor device needs.

Read more...
Standalone H.264 video streaming board
Rugged Interconnect Technologies Computer/Embedded Technology
The XStream-SD4 is an intelligent, standalone, ultra-low latency H.264 streaming solution that accepts 4x NTSC/PAL/RS-170 composite video sources and records and streams them over 100/1000 Mbps Ethernet. ...

Read more...