News


New report explores PCB technology trends

22 July 2015 News

The 2014 edition of IPC’s biennial ‘PCB Technology Trends’ study has been published and is now available. The survey-based study shows how global printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.

Based on data collected from 158 companies worldwide, the 173-page study presents the aggregate data segmented by application for five key segments: computers and telecommunications, consumer electronics, industrial and automotive electronics, medical electronics, and military and aerospace electronics.

The study covers such issues as clock speed, heat dissipation, operation cycles, product life expectancy, environmental operating range, lamination cycles, board thickness, layer counts, line width and spacing, via diameters, aspect ratios, use of embedded technologies, surface-mount land dimensions, I/O pitch, test density, recyclable content, component size, and numbers of leads, solder joints and components per board area.

Among the many interesting findings, the study reports that nearly half of the responding PCB manufacturers for computer and telecommunications applications expect their highest clock speeds in 2019 to exceed 25 GHz. This segment had the highest clock speed predictions.

The military and aerospace segment reported that heat dissipation is a design-limiting factor in half of their devices currently, which is the highest of the five applications studied, and they expect that percentage to rise in the next four years. More than one third of responding companies in the military and aerospace segment are currently embedding passive components in their boards. Embedding of passive and active components is expected to increase substantially by 2019 for all five applications studied.

‘PCB Technology Trends 2014’ is available free to companies that participated in the survey, and can be purchased by IPC members as well as non-members.

For more information visit www.ipc.org/pcb-tech-trends-2014





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved