DSP, Micros & Memory


MCUs for industrial IoT

22 July 2015 DSP, Micros & Memory

M2M communication in industrial equipment has created demand for MCUs (microcontrollers) that are optimised for a range of performance levels, from sensor nodes operating at around 30 MHz to controllers operating at 200 MHz and above, and also for scalability in order to reduce the man-hours required for software and hardware development.

To address this market, Renesas Electronics introduced the RX71M group as the new flagship product in the RX family of 32-bit MCUs. They double the CPU operating frequency of previous products to 240 MHz and are available with up to 4 MB of on-chip Flash memory.

To support the increasing diversity of communication standards accompanying the trend toward the Internet of Things (IoT), the RX71M expands the list of supported communication interfaces beyond the earlier CAN and SPI to include SD host interface, USB High Speed (built into the PHY) and dual-channel Ethernet with IEEE 1588 support. This provides connectivity with a wide variety of devices demanded in today’s industrial equipment.

In response to the increased security risks accompanying the proliferation of communication standards, high-speed encryption functions (AES, DES, SHA and RNG) are implemented in on-chip hardware. This provides robust protection against leaks of important data and communication data.

Previous Renesas MCUs offered functionality to protect leaks of post-development code by preventing code stored in the on-chip Flash memory from being read by external devices. RX71M expands this coverage to the development stage with a trusted memory function that protects important algorithms from being leaked or copied without authorisation.

The trusted memory function sets aside a special area of memory from which code cannot be read (copied) even by the internal modules of the microcontroller, such as the on-chip Flash memory. This function prevents core software technology from being disclosed, even when development takes place at overseas facilities or is undertaken jointly with other companies.

A total of 112 product versions are available with package pin counts ranging from 100 to 177 pins and on-chip Flash memory capacities from 2 MB to 4 MB. They boast CoreMark/MHz performance of 4,4 at 240 MHz, and maintain backward compatibility with earlier RX families in aspects such as peripheral functions, development tools and pin assignments.

For more information contact Marinus Rudman, Hi-Q Electronics, +27 (0)21 595 1307, [email protected], www.hi-q.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved