Mercury Systems is bringing flexibility to external I/O with its Ensemble IOM-141 streaming I/O Switched Mezzanine Card (XMC), providing 2,5 Gbaud of full-duplex bandwidth per channel and four channels per card.
With fibre connection distances of up to 150 metres and with a latency as low as 4 s, it is ideally suited as the real-time digital interface for sensor input or data output in a high-performance embedded system.
Each channel is programmable for data distribution without processor intervention. Although the data destination is typically a PCIe targeted memory, with Mercury’s system-focused approach and drivers, destinations may be anywhere where fabric based connectivity exists, even when mode changes are called for.
The IOM-141 can inspect the input data stream that indicates sensor mode changes and route data appropriately for each different mode. Each mode can be made to correspond with an application-defined Direct Memory Access (DMA) Command Packet (CP) chain. These command packets cause the channel’s DMA controller to route the data to a predefined destination anywhere within the system’s switch fabric.
Mercury provides a data transfer facility layered on top of the standard Mercury Interprocessor Communication System (ICS). This facility consists of a set of user-callable I/O control functions. These functions are used to define I/O transfer requests (DMA command packets) and to link such requests into a chain that is then automatically executed by the designated I/O device.
Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...Choosing a GNSS receiver RF Design
Telecoms, Datacoms, Wireless, IoT
Applications requiring sub-ten-meter positioning accuracy today can choose between single-band or dual-band technology. While this decision might seem as simple as flipping a coin, it is far from that.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...Energy harvesting and Matter for smarter homes RF Design
Power Electronics / Power Management
Qorvo’s collaboration with e-peas on the Matter Enabled Light Switch marks another significant step in advancing Matter adoption across the IoT industry.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...Wi-Fi 7 front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version