2 September 2015Manufacturing / Production Technology, Hardware & Services
Panasonic’s CM602 is a high-speed, multifunctional placement machine with a light-head recognition camera and linear motor that enable high levels of throughput.
It permits placement of components ranging from 0402 metric chips up to 90 x 100 mm, on boards as large as 45,72 x 50,8 cm.
Fully compatible with CM series feeder units, nozzles and operation, this single platform solution can place up to 100 000 components per hour with an optimal combination of high-speed and multifunctional heads.
Next-level conformal coating Techmet
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The ASYMTEK Select Coat SL-1040 Series is Nordson Electronics Solutions’ most advanced conformal coating solution for high-volume production.
Read more...The impact of ML in robotics Yaskawa Southern Africa
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The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
Read more...ITW EAE wins product introduction award Allan McKinnon & Associates
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ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
Read more...Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
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Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
Read more...High-speed multi-function dispensing Techmet
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Read more...Optical inspection for SMT Techmet
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The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
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Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Read more...Flexible printed electronics substrates
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
Read more...Analog Devices and Mouser collaborate on eBook
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Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.