Manufacturing / Production Technology, Hardware & Services


Laminates for high-frequency circuit boards

4 November 2015 Manufacturing / Production Technology, Hardware & Services

Rogers Corporation has unveiled ULTRALAM 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, these adhesiveless laminates use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications such as in mobile and Internet communications devices and automotive radar systems.

The high melt temperature of ULTRALAM 3850HT LCP circuit materials helps them survive multiple solder reflow procedures and increases multilayer boards’ processing temperature window. They have a design dielectric constant of 3,14 at 10 GHz and +23°C, with a typical dissipation factor of 0,0020 at 10 GHz and +23°C.

The coefficient of thermal expansion (CTE) from +30°C to +150° is typically 18 ppm/°C in the x and y dimensions of the material and 200 ppm/°C through the thickness (z dimension) of the material, providing good dimensional stability, predictable multilayer board scaling, and good registration. The circuit material features thermal conductivity of 0,2 W/m/K and thermal coefficient of dielectric constant of +24 ppm/°C from -50°C to +150°C.

ULTRALAM 3850HT circuit materials are available in panels of double copper-clad laminates and can be used with ULTRALAM 3908 bonding film for multilayer constructions. Standard panel sizes include 457 x 305 mm and 457 x 610 mm with 9 m and 18 m low-profile electrodeposited (ED) copper. Panels with rolled copper and in custom sizes are available upon request.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, andrew@rfdesign.co.za, www.rfdesign.co.za



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