Bluetooth LE ICs and module
27 January 2016
Telecoms, Datacoms, Wireless, IoT
Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE (Low Energy) RF ICs, and the BM70 module, expand Microchip’s existing Bluetooth portfolio and carry worldwide regulatory and Bluetooth Special Interest Group (SIG) certifications. These new offerings are ideal for Internet of Things and Bluetooth Beacon applications, making it easy for designers to take advantage of the low power consumption and simplicity of Bluetooth LE connectivity.
The new devices include an integrated, certified Bluetooth 4.2 firmware stack through which developers can expect up to 2,5 times faster data transfer speeds and greater connection security, with government-grade (FIPS-based) secure connection support.
Data is sent and received over the Bluetooth link using Transparent UART mode, making it easy to integrate with any processor or the hundreds of Microchip’s PIC microcontrollers that have a UART interface. The module also supports standalone ‘hostless’ operation for beacon applications.
The optimised power profile of these new devices minimises current consumption for extended battery life, whilst compact form factors (down to 4 x 4 mm for the RF ICs and 15 x 12 mm for the module) reduce board space. The module options include RF regulatory certifications, or non-certified (unshielded/antenna-less) modules for smaller and more remote antenna designs that will undergo end-product emission certifications.
The Bluetooth LE modules include all of the hardware, software and certifications that designers need. Developers can leverage Microchip’s Bluetooth Qualified Design ID (QDID) to easily list their products with the Bluetooth SIG. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for Transparent UART. All modules are configurable using Microchip’s Windows OS-based tools.
Microchip also announced the BM70 Bluetooth Low Energy PICtail/PICtail Plus daughter board. This tool enables code development via USB interface to a PC, or by connecting to Microchip’s existing microcontroller development boards such as the Explorer 16, PIC18 Explorer and PIC32 I/O Expansion Board.
For more information contact Shane Padayachee, Avnet South Africa, +27 (0)11 319 8600, [email protected], www.avnet.co.za
Further reading:
Strategic agreement for eSIM solutions
Avnet Silica
Telecoms, Datacoms, Wireless, IoT
This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
Read more...
High precision multi-GNSS antenna
RS South Africa
Telecoms, Datacoms, Wireless, IoT
The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
Read more...
Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...
Robust LoRaWAN for distributed IoT
Telecoms, Datacoms, Wireless, IoT
InHand Networks has unveiled its latest LoRaWAN gateway, the EC312, marking an evolution in industrial-grade connectivity solutions for distributed IoT environments.
Read more...
Miniaturised tuneable harmonic filter bank
RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Modern RF and microwave communication systems require compact, high power filtering solutions to suppress unwanted harmonic signals generated by power amplifiers, and to address this challenge, Tri-TeQ has developed a miniaturised broadband tuneable harmonic switched filter bank.
Read more...
Nordic accelerates cellular IoT leadership
RF Design
Telecoms, Datacoms, Wireless, IoT
The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
Read more...
Powering the future of industrial automation
IOT Electronics
Telecoms, Datacoms, Wireless, IoT
5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
Read more...
Wi-Fi 7 tri-band connectivity module
iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...
Compact cellular IoT SiP with GNSS
RF Design
Telecoms, Datacoms, Wireless, IoT
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
Read more...
Enabling the next generation of high-performance wireless designs
iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
Read more...