Reflow soldering systems

27 January 2016 Manufacturing / Production Technology, Hardware & Services

With a heating zone length of 1850 mm or 2350 mm, Seho’s convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series. Their double peak zones provide maximum flexibility in temperature profiling, particularly for lead-free soldering processes.

The GoReflow 1.8 and GoReflow 2.3 have five and seven heating zones respectively, with an average working speed of 0,40 – 0,55 m/min for the former and 0,55 – 0,70 m/min for the latter. They are designed for soldering in ambient atmosphere. A high volume of circulated process gas, which is generated with axial fans, specially adapted slot nozzles and re-circulation of the process gas on the sides, ensure a very homogeneous heat distribution over the complete transport width at simultaneously low flow velocities.

For special applications requiring nitrogen, the peak area can be inerted. The GoReflow systems are equipped with a fan cooling unit, circulating ambient air which is used for cooling of the assemblies after the reflow process. Horizontal slot nozzles ensure a directed air flow and thus effective cooling of the boards.

For more information contact Igmar Grewar, Quamba Technologies, +27 (0)83 417 4294, [email protected], www.quamba.co.za

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