Manufacturing / Production Technology, Hardware & Services


Improved heat dissipation for multilayer PCBs

23 March 2016 Manufacturing / Production Technology, Hardware & Services

Teledyne Labtech, based in Wales, announced a new technology it has developed to dissipate heat from multilayer printed circuit boards.

Called Copper Coin, this technology is ideal to dissipate heat out from high-frequency RF and microwave components and high-speed processors.

The design increases the physical area available for heat conduction from the component out of the board to a heat transfer material. Heat-generating components mounted on the coin are in direct contact with the larger areas of copper with a high thermal conductivity, ensuring high heat dissipation performance.

The Copper Coin structure was made possible by state-of-the-art laser drilling and manufacturing technologies and the years of experience available at the Labtech facility. The company specialises in LCP metal-cored multilayer PCBs, mixed dielectric multilayer PCBs, metal cored multilayer PCBs and thin dielectric PCBs. It also offers an MMIC assembly service to package more than one MMIC device into a single QFN package with a company exclusive part number. Labtech also performs microwave assembly and testing in its facility.

For more information contact Conical Technologies, +27 (0)12 347 5035, daniel.haywood@conical.co.za, www.conical.co.za



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