Low-profile power module
20 April 2016
Power Electronics / Power Management
Microchip announced an integrated switching power module designed specifically for height-constrained telecom, industrial and solid-state drive (SSD) applications. The new MIC45404 comes in a thermally enhanced package that incorporates inductors and passive components into a single, moulded power converter. The slim 10 x 6 x 2 mm package saves space in customers’ designs, simplifies board design, and eliminates concern over passive components that may introduce unexpected electromagnetic interference (EMI).
The chip incorporates one of the thinnest integrated magnetic inductors available in a 19 V, 5 A point-of-load buck converter.
Integrated components include the controller, metal-oxide semiconductor field-effect transistors (MOSFETs), feedback path and pulse width modulation (PWM) switching regulator. It also offers pin-selectable output voltages, switching frequencies and current limits.
The low profile of the module allows it to be placed on the back of a PCB, on a daughter card, or other placement where vertical height may be constrained in point-of-load power conversion, telecom and industrial applications.
For more information contact Shane Padayachee, Avnet South Africa, +27 (0)11 319 8600, shane.padayachee@avnet.eu, www.avnet.co.za.
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