The NEO-M8T and LEA-M8T concurrent GNSS modules from u-blox deliver high-integrity, precision timing in demanding applications worldwide. Support for BeiDou, GLONASS and Galileo constellations enables compliance with national requirements.
Enhanced sensitivity and concurrent constellation reception extend coverage and integrity to challenging signal environments.
Survey-in and fixed-position navigation reduce timing jitter, even at low signal levels, and enable synchronisation to be maintained with as few as one single satellite in view. Support for low duty cycle operation reduces power consumption for battery-powered applications.
u-blox timing products include timing integrity measures with receiver autonomous integrity monitoring (RAIM) and continuous phase uncertainty estimation. They feature high dynamic range radios with both analog and digital interference mitigation, supporting applications in wireless communications equipment.
The M8T timing modules are delivered in u-blox’s established LEA and NEO form factors with standard pin-out, allowing ready migration from previous product generations. They can make use of u-blox AssistNow or industry standard aiding data. This reduces the time to first fix and delivers exceptional acquisition sensitivity, even on first installation before precise location, time or frequency are known.
u-blox M8 modules use GNSS chips qualified according to AEC–Q100, are manufactured in ISO/TS 16949 certified sites, and are fully tested on a system level. Qualification tests are performed as stipulated in the ISO 16750 standard: ‘Road vehicles – Environmental conditions and testing for electrical and electronic equipment’.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.