13 July 2016Manufacturing / Production Technology, Hardware & Services
RS Components has introduced a range of protective coatings from MG Chemicals that are designed specifically for electronics prototyping and production.
This initial introduction includes conductive epoxies, conformal coatings and conductive greases, as well as potting and encapsulating epoxies.
Targeting electronics production, design engineers, buyers for OEMs and contract electronic manufacturers, the key products from MG Chemicals include conductive greases such as: the 846 carbon-conductive grease, which inhibits corrosion and repels humidity, and is ideal for protecting switches or bridging the gap between contacting surfaces for EMI shielding applications; and the 847 carbon-conductive assembly paste, which is a non-bleeding grease designed to improve electrical connections between non-moving surfaces and parts.
Other highlights of the range are potting and encapsulating epoxies including black and translucent epoxy for protection against static discharges, shocks, vibrations and mechanical impacts, as well as insulation against heat and conductivity. Also available are conformal coatings that are designed to protect assembled PCB circuitry from harsh environmental conditions including moisture, chemicals and other contaminants such as salt spray, debris and dust.
In addition, the range includes electrically conductive epoxies that bond, seal and adhere to most substrates used in electronic assemblies. They provide reliable and uniform electrical conductivity, superior substrate adhesion, and the physical strength to resist thermal and mechanical shocks.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...UV curing oven for high-efficiency PCB production Techmet
Manufacturing / Production Technology, Hardware & Services
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.
Read more...Automatic stencil cleaning ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.