Logic functions in smallest package

9 November 2016 Analogue, Mixed Signal, LSI

NXP Semiconductors introduced the world’s smallest leadless logic package for 8-lead logic functions. Measuring just 0,8 x 1,35 mm and only 0,35 mm in height, the GX 8 (SOT1233) package is especially suitable for mobile, portable and IoT applications as it not only saves space and has a more rugged design, it also reduces PCB assembly costs.

The new GX 8 leadless package addresses the continual trend in electronic systems towards smaller and smaller packages, low power consumption and low system costs. Previously, NXP has released 5- and 6-pin functions in the GX package. Now with the availability of the 8-pin package, most mini logic functions are available, making it simpler for design and production engineers to respond to market requirements.

Similarly, design cycle times are being reduced, so it’s not always possible to include all the features that are eventually required using a single chip solution. NXP’s logic devices are used to provide the interface between the different ASICs and with this new introduction, most AXP, AUP and LVC functions are now available in a GX package, addressing designers’ needs for the largest spectrum of standard logic functions in the smallest package possible.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com

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