Henkel’s GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components. The soft and compliant gap filling material has a thermal conductivity of 5,0 W/m-K and delivers outstanding thermal performance with very low compression stress. The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.
GAP PAD HC 5.0 allows for superb interfacing and wet-out, even to rough surfaces and topographies, which ensures uniform material coverage across the component and heatsink for maximum performance. Compared to previous-generation materials, it offers better handling, an enhanced dielectric constant, improved volume resistivity and better thermal impedance performance.
Manufactured with a natural tack on both sides, GAP PAD HC 5.0 contains no thermally-impeding adhesive layers and is available in a range of thickness from 0,508 mm up to 3,175 mm.
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Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
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At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
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Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
Read more...Global electronics solutions since 1964 IMP Electronics Solutions
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Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
Read more...Driving excellence in electronics manufacturing Jemstech
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Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.
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Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
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