22 March 2017Manufacturing / Production Technology, Hardware & Services
Henkel’s Loctite AbleStik ICP 3535M1 is an electrically conductive adhesive (ECA) that provides a robust alternative to solder for many applications, lowers component assembly stress and facilitates lead-free interconnection for regulatory compliance. The material recently gained acceptance at global automotive electronics manufacturers, where it is being used successfully for the production of transmission control units and qualified for several other automotive applications.
Internal and customer qualification testing have confirmed the material’s stable contact resistance and good mechanical integrity after 3000 hours of temperature and humidity testing, 3000 cycles of thermal shock evaluation and 3000 hours of heat storage. Excellent performance on smaller components also underscores its effectiveness for the reduction of defects. Evaluation of the material on 0402 components resulted in zero bridging or wicking, and the material is equally effective on larger devices such as MOSFETs.
Whereas other ECAs are unable to cope with non-noble metals on component terminations, Loctite AbleStik ICP 3535M1 is effective on traditional palladium silver-, silver- and gold-finished components, as well as cost-effective tin-terminated components. Applications within the aerospace, wireless datacom, security and lighting sectors will also benefit from the material’s flexibility, reliability and cost reduction capability.
200 W of power in a space-saving design Vepac Electronics
Manufacturing / Production Technology, Hardware & Services
The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.
Read more...FineX: Makes shielding clear Avnet Abacus
Manufacturing / Production Technology, Hardware & Services
Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.
Read more...Collaboration is now critical RS South Africa
Manufacturing / Production Technology, Hardware & Services
The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
Manufacturing / Production Technology, Hardware & Services
Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.