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Low-power DDR2 memory chips
17 May 2017, DSP, Micros & Memory
Alliance Memory introduced a new line of high-speed CMOS mobile low-power DDR2 (LPDDR2) SDRAMs with densities of 1 Gb, 2 Gb and 4 Gb in a 134-ball FBGA package. The devices offer a variety of power-saving features, including 1,2 V/1,8 V operating voltages, to extend battery life in portable electronics, while their high density enables ultra-slim designs.
The chips provide reliable drop-in, pin-to-pin compatible replacements for a number of similar solutions in ultra-low-voltage cores and I/O power supplies for mobile devices such as smartphones and tablets. For these products, the ICs feature auto temperature-compensated self-refresh (TCSR) to minimise power consumption at lower ambient temperatures. In addition, their partial-array self-refresh (PASR) feature reduces power by only refreshing critical data, while a deep power down (DPD) mode provides an ultra-low power state when data retention isn’t required.
Featuring a double data rate four-bit prefetch architecture, the LPDDR2 SDRAMs deliver high-speed operation with clock rates of 400 MHz and 533 MHz, and are available in commercial (-30°C to +85°C) and industrial (-40°C to +85°C) temperature ranges. The devices offer programmable read or write burst lengths of 4, 8 or 16; an auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh. |
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Further reading:
- Mixed-signal MCUs for digital power
26 June 2019, EBV Electrolink, DSP, Micros & Memory
Targeted at advanced digital power applications and consumer and industrial appliances, the new STM32G4 microcontrollers (MCUs) introduce two new hardware mathematical accelerators to boost processing ...
- Memory IC combines NAND and LPDDR
26 June 2019, iCorp Technologies, DSP, Micros & Memory
The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are ...
- Flash memories with embedded MAC addresses
26 June 2019, Avnet South Africa, DSP, Micros & Memory
Microchip Technology’s SST26VF Serial Quad I/O (SQI) 3 V Flash family is the industry’s first NOR Flash devices to offer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, ...
- Dual- and single-core DSCs
29 May 2019, Avnet South Africa, DSP, Micros & Memory
New dual- and single-core dsPIC33C digital signal controllers (DSCs) have been released by Microchip Technology, with more options to meet changing application requirements across memory, temperature ...
- MPUs for open-source software-based designs
29 May 2019, Altron Arrow, DSP, Micros & Memory
STMicroelectronics is applying its Arm Cortex expertise to expand the capabilities of its STM32 microcontroller (MCU) portfolio to applications requiring even more performance, resources and large open-source ...
- MCUs for advanced security and physical protection
29 May 2019, EBV Electrolink, DSP, Micros & Memory
The new K32 microcontroller (MCU) series from NXP Semiconductors is optimised for energy efficiency in real-time embedded applications, and enables advanced security with physical tamper protection in ...
- MCUs with water-tolerant touch integration
29 May 2019, EBV Electrolink, DSP, Micros & Memory
The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
- Wi-Fi microcontroller
29 May 2019, iCorp Technologies, DSP, Micros & Memory, Switches, Relays & Keypads
The ESP32-S2 from Espressif Systems is a highly integrated, low-power, 2,4 GHz Wi-Fi microcontroller SoC (system-on-chip) supporting Wi-Fi HT40 and 43 general-purpose I/Os. Based on an Xtensa single-core ...
- DSCs with USB and CAN FD support
29 May 2019, EBV Electrolink, DSP, Micros & Memory
NXP Semiconductors’ MC56F83xxx digital signal controllers (DSC) family offers peripheral enhancements ideal for high-performance digital power conversion and advanced motor control applications.
The ...
- MCUs for touch-free UI
30 April 2019, Hi-Q Electronics, DSP, Micros & Memory
Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs), ...
- MCUs with water-tolerant touch integration
30 April 2019, EBV Electrolink, DSP, Micros & Memory
The 5 V KE1xZ family of microcontrollers (MCU), made by NXP Semiconductor and based on the Arm Cortex M0+, enables embedded control systems in harsh electrical environments, with an integrated CAN controller, ...
- MCUs for industrial IoT endpoints
27 March 2019, Hi-Q Electronics, DSP, Micros & Memory
Renesas Electronics’ new highly integrated S5D3 MCUs (microcontrollers) simplify application development with their secure cryptographic engine and Synergy software package. Equipped with advanced security, ...
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